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Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621 AND 623 SERIES
Standard P/N 621A 621K 623A 623K
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Height in. (mm) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) 0.461 (11.7) Mounting Hole Pattern (1) TO-3 None (1) TO-3 None Thermal Performance at Typical Load Natural Forced Convection Convection 75C @ 15W 75C @ 15W 52C @ 15W 52C @ 15W 2.0C/W @ 250 LFM 2.0C/W @ 250 LFM 1.5C/W @ 250 LFM 1.5C/W @ 250 LFM
TO-3
Footprint Dimensions in. (mm) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 1.500 (38.1) 4.750 (120.6) x 3.000 (76.2) 4.750 (120.6) x 3.000 (76.2)
Weight lbs. (grams) 0.1000 (45.36) 0.1000 (45.36) 0.2100 (95.26) 0.210O (95.26)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES
A K
Dimensions: in. (mm)
301/302/303 SERIES
Standard P/N 301K 301M 301N 302M 302MM 302N 302NN 303M 303MM 303N 303NN
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
Length "A" in. (mm) 0.750 (19.1) 0.750 (19.1) 0.750 (19.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) Mounting Hole (s) Pattern and Number None (1) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (2) 14 -28UNF, 0.625 in. thread depth (1) 10-32UNF, 0.625 in. thread depth (2) 10-32UNF, 0.625 in. thread depth (1) 14 -28UNF, 0.625 in. thread depth (2) 14 -28UNF, 0.625 in. thread depth Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 15W 70 C @ 15W 70 C @ 15W 50 C @ 15W 50C @ 15W 5OC @ 15W 50C @ 15W 37 C @ 15W 37 C @ 15W 37 C @ 15W 37 C @ 15W 2.5 C/W @ 250 LFM 2.5 C/W @ 250 LFM 2.5 C/W @ 250 LFM 1.8 C/W @ 250 LFM 1.8C/W @ 250 LFM 1.8 C/W @ 250 LFM 1.8C/W @ 250 LFM 1.3 C/W @ 250 LFM 1.3 C/W @ 250 LFM 1.3 C/W @ 250 LFM 1.3 C/W @ 250 LFM
STUD-MOUNT Weight lbs. (grams) 0.0580 (26.31) 0.0580 (26.31) 0.0580 (26.31) 0.1330 (60.33) 0.1330 (6033) 0.1330 (60.33) 0.1330 (60.33) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56) 0.2680 (121.56)
Outline Dimensions in. (mm) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8) 2.000 (50.8) x 2.000 (50.8)
The large fin area in minimum total volume provided by the radial design of the 301/302/303 Series offers maximum heat transfer efficiency in natural convection. All types are available with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations ("MM" and "NN" mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black Anodized.
NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES
MECHANICAL DIMENSIONS
K
M
N
302 AND 303 SERIES
Dimensions: in. (mm)
301 SERIES
SERIES 301 302 303
641 SERIES
Standard P/N
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Outline Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern Thermal Performance at Typical Load Natural Forced Convection Convection
TO-3 Weight lbs. (grams)
641A 641K
4.125 (104.8) x 3.000 (76.2) 4.125 (104.8) x 3.000 (76.2)
1.000 (25.4) 1.000 (25.4)
(1) TO-3 None
36C @ 15W 36C @ 15W
0.9C/W @ 250 LFM 0.9C/W @ 250 LFM
0.2900 (131.54) 0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Material: Aluminum Alloy, Black Anodized.
NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
641 SERIES (EXTRUSION PROFILE 1371)
SEMICONDUCTOR MOUNTING HOLES
A K
Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums.
50
Normally stocked
Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles
Standard P/N 401A 401F 401K 403A 403F 403K Width in. (mm) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) Overall Dimensions in. (mm) 1.500 (38.1) 1.500 (38.1) 1.500 (38.1) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) Height in. (mm) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) 1.250 (31.8) Semiconductor Mounting Hole Pattem (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None Thermal Performance at Typical Load Natural Convection Forced Convection 80C @ 30W 80C @ 30W 80C @ 30W 55C @ 30W 55C @ 30W 55C @ 30W 1.5 C/W @ 250 LFM 1.5 C/W @ 250 LFM 1.5 C/W @ 250 LFM 0.9 C/W @ 250 LFM 0.9 C/W @ 250 LFM 0.9 C/W @ 250 LFM TO-3; Stud-Mount Weight lbs. (grams) 0.1500 (68.04) 0.1500 (68.04) 0.1500 (68.04) 0.3500 (158.76) 0.3500 (158.76 0.3500 (158.76)
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style "F" offers a single centered
0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattem "V" available upon request. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
403 SERIES
401 SERIES
Dimensions: in. (mm)
A
SEMICONDUCTOR MOUNTING HOLES
F K V
401 AND 403 SERIES (EXTRUSION PROFILE 1024)
413/421/423 SERIES
Standard P/N 413A 413F 413K 421A 421F 421K 423A 423K Width in. (mm) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7) 4.750 (120.7)
Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes
Nominal Dimensions Length in. (mm) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 3.000 (76.2) 5.500 (140.2) 5.500 (140.2) Height "A" in. (mm) 1.875 (47.6) 1.875 (47.6) 1.875 (47.6) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7) 2.625 (66.7)
TO-3; DO-5; Stud-Mount Weight lbs. (grams) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 0.6300 (285.77) 1.1700 (530.71) 1.1700 (530.71)
Semiconductor Thermal Performance at Typical Load Mounting Hole Pattern Natural Convection Forced Convection (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 0.270 in. (6.9)-Dia Hole None (1) TO-3 None 72 C @ 50W 72 C @ 50W 72 C @ 50W 58 C @ 50W 58 C @ 50W 58 C @ 50W 47 C @ 50W 47 C @ 50W 0.85 C/W @ 250 LFM 0.85 C/W @ 250 LFM 0.85 C/W @ 250 LFM 0.7 C/W @ 250 LFM 0.7 C/W @ 250 LFM 0.7 C/W @ 250 LFM 0.5 C/W @ 250 LFM 0.5 C/W @ 250 LFM
Space-saving double surface 413, 421, and 423 Series utilize finned surface area on both sides of the power semiconductor mounting surface to provide maximum heat dissipation in a compact profile. Ready to install on popular power components in natural and forced convection applications. Apply
Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPadTM interface materials for maximum performance. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
413 SERIES (EXTRUSION PROFILE 2276 421 SERIES (EXTRUSION PROFILE 1025)
423 SERIES (EXTRUSION PROFILE 1025)
SEMICONDUCTOR MOUNTING HOLES
A F K V
SERIES 413 421
Dimensions: in. (mm)
Normally stocked
51
All other products, please contact factory for price, delivery, and minimums.
Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
431 AND 433 SERIES
High-Performance Heat Sinks for 30-100W Metal Power Semiconductors
TO-3; Stud-Mount
Nominal Dimensions Standard Width Length "A" Height Semiconductor Thermal Performance at Typical Load P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection 431K 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) None 55C @ 5OW 0.40C/W @ 250 LFM 433K 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) None 42C @ 5OW 0.28C/W @ 250 LFM
Need maximum heat dissipation from a TO-3 rectifier heat sink in minimum space? The Wakefield 431 and 433 Series center channel double-surface heat sinks offer the highest performance-to-weight ratio for minimum volume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to
Weight lbs. (grams) 0.7800 (353.81) 1.4900 (675.86)
100-watt operating range. Additional interface resistance reduction for maximized overall performance can be achieved with proper application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SERIES 431 433
NATURAL AND FORCED CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLE
431 AND 433 SERIES (EXTRUSION PROFILE 2726)
K
Dimensions: in. (mm)
435 SERIES
Standard P/N 435AAAA
Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles
Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.250(108.0) 5.500(139.7) 4.300(109.2)
TO-3
Semiconductor Thermal Performance at Typical Load Weight Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) (4) TO-3 37C @ 50W 0.38C/W @ 250 LFM 1.1500 (521.64) 54C @ 80W 0.24C/W @ 600 LFM
the proper selection and installation of a Wakefield Type 175 DeltaPad KaptonTM interface material for each power semiconductor or, for maximum reduction of case-to-sink interface loss, the application of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black Anodized.
This lightweight high-performance heat sink is designed to mount and cool efficiently one to four TO-3 style metal case power semiconductors. The Type 435AAAA is the standard configuration available from stock, predrilled for mounting four TO-3 style devices. Increased performance can be achieved with
MECHANICAL DIMENSIONS
Dimensions: in. (mm) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES
AAAA
435 SERIES (EXTRUSION PROFILE 4226)
441 SERIES
Standard P/N 441K
High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes
Nominal Dimensions Width Length Height in. (mm) in. (mm) in. (mm) 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) Semiconductor Mounting Hole Pattern None Thermal Performance at Typical Load Natural Convection Forced Convection 34C @ SOW 0.30C/W @ 250 LFM 47C @ 80W 0.19C/W @ 600 LFM
Stud-Mount
Weight lbs. (grams) 1.9700 (893.59)
Designed for vertical mounting within a power supply enclosure or equipment cabinet without forced airflow available. This Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a maximum 55C heat sink temperature rise above ambient. When applied in a forced Dimensions: in. (mm)
convection environment, the 441K Type will achieve thermal resistance of 0.18C/W (sink to ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLE
K 441 SERIES (EXTRUSION PROFILE 1273)
NATURAL AND FORCED CONVECTION CHARACTERISTICS
All other products, please contact factory for price, delivery, and minimums.
52
Normally stocked
Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
465 AND 476 SERIES
Standard P/N 465K 476K 476W Width in. (mm) 4.000 (101.6) 5.000 (127.0) 5.000 (127.0)
High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes
Nominal Dimensions Length in. (mm) 5.000 (127.0) 6.000 (152.4) 6.000 (152.4) Height in. (mm) 4.000 (101.6) 5.000 (127.0) 5.000 (127.0) Hex Style Type 1.060 in. Hex 1.250 in. Hex 1.250 in. Hex Mounting Hole Pattern None None 0.765 in. (19.4)Dia. Center Mount Thermal Performance at Typical Load Natural Convection Forced Convection 38C @ 5OW 25C @ 5OW 25C @ 5OW 0.27C/W @500 LFM 0.19C/W @500 LFM 0.19C/W @500 LFM
Stud-Mount Weight lbs. (grams) 1.9300 (875.45) 2.8200(1279.15) 2.8000(1270.08)
Wakefield Engineering has designed four standard heat sink types for ease of installation and efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are
designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized.
MECHANICAL DIMENSIONS
465 SERIES (EXTRUSION PROFILE 1244) 476 SERIES (EXTRUSION PROFILE 1245)
NATURAL AND FORCED CONVECTION CHARACTERISTICS
K
W
SEMICONDUCTOR MOUNTING HOLES
Dimensions: in. (mm)
486 AND 489 SERIES
Standard P/N 486K 489K Width in. (mm) 6.250 (158.8) 6.250 (158.8)
Heat Sinks for High-Power Hex-Type Rectifiers and Diodes
Nominal Dimensions Length in. (mm) 6.000 (152.4) 9.000 (228.6) Height in. (mm) 6.250 (158.8) 6.250 (158.8) Hex Style Type 1.750 in. Hex 1.750 in. Hex Mounting Hole Pattern None None Thermal Performance at Typical Load Natural Convection Forced Convection 24 C @ 50W 86 C @ 250W 19 C @ 50W 75 C @ 250W 0.20 C/W @250 LFM 0.13 C/W @500 LFM 0.15 C/W @250 LFM 0.10 C/W @500 LFM
Stud-Mount Weight lbs. (grams) 4.2100 (1909.66) 6.1400 (2785.10)
These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000
in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLE
K
NATURAL AND FORCED CONVECTION CHARACTERISTICS
SERIES
486 AND 489 SERIES (EXTRUSION PROFILE 1541)
Dimensions: in. (mm)
486 489
Normally stocked
53
All other products, please contact factory for price, delivery, and minimums.
Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
490 SERIES
King Size Heat Sinks for High-Power Rectifiers
Width in. (mm) 9.250 (235.0) 9.250 (235.0) 9.250 (235.0) Nominal Dimensions Length "A" in. (mm) 3.500 (88.9) 6.000 (152.4) 12.000 (304.8) Height in. (mm) 6.750 (171.5) 6.750 (171.5) 6.750 (171.5) Semiconductor Mounting Hole Pattern None None None Thermal Performance at Typical Load Natural Convection Forced Convection 84 C @ 20OW 60 C @ 20OW 45 C @ 20OW 0.18 C/W @ 600 LFM 0.13 C/W @ 600 LFM 0.09 C/W @ 600 LFM
GENERAL PURPOSE
Standard P/N 490-35K 490-6K 490-12K
Weight lbs. (grams) 3.2400(1469.66) 5.4700(2481.19) 10.62 (4817.23)
The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller power devices. The semiconductor device mounting surface is free of anodize on the entire surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see accessories section) for mounting to enclosure wall and for electrical isolation. The
anodize-free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLE
NATURAL AND FORCED CONVECTION CHARACTERISTICS
490 SERIES (EXTRUSION PROFILE 2131)
Dimensions: in. (mm)
PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT'S
394, 395, 396 SERIES
Standard P/N Overall Dimensions: in. (mm) Length Height in. (mm) in. (mm) Width in. (mm) Device Base Mounting Area (mm) Base Mounting Holes 4 6 4 6 4 6 Thermal Resistance at Typical Load Natural Forced Convection (Osa)(1) Convection (Osa) (C/W) (C/W @ 500 LFM) 1.85 1.51 1.10 0.90 1.85 1.51 0.90 0.60 0.50 0.32 1.07 0.64
394-1AB 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 394-2AB 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 395-1AB 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 395-2AB 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 396-1AB 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 396-2AB 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 Note: 1.Thermal resistance values shown are for black anodized finish at 50C rise above ambient.
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
394 SERIES (EXTRUSION PROFILE 7332)
NATURAL AND FORCED CONVECTION CHARACTERISTICS
395 SERIES (EXTRUSION PROFILE 7330)
NATURAL AND FORCED CONVECTION CHARACTERISTICS
396 SERIES (EXTRUSION PROFILE 7331)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
54
Normally stocked
Extruded Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
SERIES 517, 527, 518 AND 528
Heat Sinks for "Half Brick" DC/DC Converters
TO-220 and TO-218
Standard P/N
Footprint Dimensions in. (mm)
Height in. (mm) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1) 0.95 (24.1) 0.45 (11.4) 0.24 (6.1)
Fin Orientation Horizontal Horizontal Horizontal Vertical Vertical Vertical
Number of Fins 8 11 11 8 11 11
Thermal Performance Natural Convection Forced Convection Power Dissipation (Watts) Thermal Resistance 60C Rise Heat Sink to Ambient at 300 ft/min 11W 7W 5W 11W 7W 5W 2.0 C/W 3.2 C/W 5.8 C/W 2.0 C/W 3.2 C/W 5.8 C/W
517-95AB 2.28 (57.9) x 2.40 (61.0) 527-45AB 2.28 (57.9) x 2.40 (61.0) 527-24AB 2.28 (57.9) x 2.40 (61.0) 518-95AB 2.40 (61.0) x 2.28 (57.9) 528-45AB 2.40 (61.0) x 2.28 (57.9) 528-24AB 2.40 (61.0) x 2.28 (57.9) Material: Aluminum, Black Anodized.
Keep your "half brick" size AT&T and Computer Products power modules cool with these efficient black anodized aluminum heat sinks made for natural or forced convection applications. To include four M3 x 8mm Phillips head SEM attachment screws, add an "M" suffix to stan-
dard part number. To specify factory applied Deltalink IV thermal interface material, add an "S4" suffix to standard part number. Deltalink IV is a non-insulating graphite based material used as a clean, thermally efficient alternative to thermal grease.
MECHANICAL DIMENSIONS
517, 527, 518 AND 528 SERIES
PRODUCT DESIGNATION
517 /527 SERIES DIMENSIONS
518 /528 SERIES DIMENSIONS
Dimensions: in. (mm)
MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS
100 SERIES Teflon Mounting Insulators
Standard P/N
v 103
Description Spool-shaped insulator Spool-shaped insulator
For Use with Series 300, 400, 600, 111, 113 300, 400, 600, 111, 113
Mounting Hardware #6-32 screw #6-32 screw, nut
Material Teflon Teflon
Hipot Rating (VAC) 1500 5000
Weight lbs. (grams) 0.00012 (0.05) 0.0034 (1.54)
107
103 SERIES
107 SERIES
Normally stocked
55
All other products, please contact factory for price, delivery, and minimums.
Extruded Heat Sinks
HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTs, RELAYS
510, 511 AND 512 SERIES
Standard Catalog P/N (5) Milled Nonmilled Base(1) Base(2)
510-3M 510-6M 510-9M 510-12M 510-14M 511-3M 511-6M 511-9M 511-12M 512-3M 512-6M 512-9M 512-12M 510-3U 510-6U 510-9U 510-12U 510-14U 511-3U 511-6U 511-9U 511-12U 512-3U 512-6U 512-9U 512-12U
Height Base Width in. (mm)
7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 7.380 (187.452) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 5.210 (132.33) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88) 7.200 (182.88)
Length in. (mm)
3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 14.000 (355.6) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8) 3.000 (76.2) 6.000 (152.4) 9.000 (228.6) 12.000 (304.8)
Milled Base (1) ("M Series") in. (mm)
3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 3.106 (78.9) 2.350 (59.7) 2,350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7) 2.350 (59.7)
Nonmilled Base (2) ("U" Series) in. (mm)
3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 3.136 (79.7) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2) 2.410 (61.2)
Thermal Resistance (5) (Osa) at Typical Load Natural Forced Convection(3) Convection(4) (C/W) (C/W @ 100 CFM)
0.56 0.38 0.29 0.24 0.21 0.90 0.65 0.56 0.45 0.90 0.65 0.56 0.45 0.088 0.070 0.066 0.062 0.059 0.120 0.068 0.060 0.045 0.120 0.068 0.060 0.045
Notes: 1. Precision-milled base for maximum heat transfer performance (flatness 0.002 in./in.)
2. Nonmilled base flatness: 0.006 in./in. 3. Natural convection heat dissipation for distributed heat sources at 50C rise.
4. Forced convection heat dissipation for distributed heat sources at 100 cubic feet per minute, shrouded condition. 5. Standard models are provided without finish. NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
510 SERIES
Series 510-U 510-M A 0.216 (5.5) 0.165 (4.2)
510 Series (Extrusion Profile 5113)
B 3.136 (79.7) 3.106 (78.9) Flatness 0.006 in./in. (0.15 mm/mm) 0.002 in./in. (0.05 mm/mm)
511 AND 512 SERIES
Series
511-U 512-U
511 Series (Extrusion Profile 6438-1) 512 Series (Extrusion Profile 6438-2)
B
2.410 (61.2) 2.350 (59.7
A
0.250 (6.4)
C
Flatness
0.372 (9.4) 0.006 in./in. (0.15 mm/mm) 0.342 (8.7) 0.002 in./in. (0.05 mm/mm)
511-M 512-M 0.220 (5.6)
Dimensions: in. (mm)
392 SERIES HIGH PERFORMANCE HEAT SINKS FOR POWER MODULES, IGBTs AND SOLID STATE RELAYS
Standard P/N, Finish Black Gold Anodized Iridite 392-120AB 392-120AG 392-180AB 392-180AG 392-300AB 392-300AG Length in. (mm) 4.725 (120.0) 7.087 (180.0) 11.811 (300.0) Thermal Resistance at Typical Load Natural Forced Convection (Osa) Convection (Osa) (CW) (CW) 0.50 0.16 @ 100 CFM 0.43 0.11 @ 100 CFM 0.33 0.08 @ 100 CFM Weight lbs. (grams) 4.452 (2019.43) 6.636 (3010.09) 1O.420 (4726.51)
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
NATURAL CONVECTION 392-120 (1 MOD) 392-180 (1 MOD) 392-300 (1 MOD) 392-300 (3 MOD)
392 SERIES (EXTRUSION PROFILE 5658)
FORCED CONVECTION 392-120 (1 MOD) 392-120 (3 MOD) 392-180 (1 MOD) 392-180 (3 MOD) 392-300 (3 MOD)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
56
Normally stocked

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